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Teledyne e2v’s CMOS image sensors and subsystems deliver high performance across many applications. Teledyne e2v’s unique approach involves listening to the market and application challenges of customers and partnering with them to provide innovative standard, semi-custom or fully custom imaging solutions.

28th Feb 2023

Teledyne e2v releases 1.5 Megapixel version of Optimom, a turnkey optical module for quick and easy development of vision systems

Grenoble, FRANCE, 28 February, 2023 — Teledyne e2v, a part of Teledyne Technologies [NYSE: TDY], announces the release of Optimom 1.5M, the latest member of the Optimom™ family, a new range of turnkey optical modules that can be instantly integrated into vision systems. Optimom 1.5M is a complete board-level vision extension made to accelerate development time, […]

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17th Jan 2023

Teledyne to present its newest scientific imaging and machine vision solutions at SPIE’s Photonics West exhibition

Teledyne will showcase their newest products and solutions at SPIE’s Photonics West exhibition taking place January 31 – February 2nd, 2023, in San Francisco, California. Visitors to the Teledyne booth #1527 can expect representation from the businesses within its Imaging group, including Teledyne DALSA, e2v, FLIR, Imaging Sensors, Acton Optics, Judson,  Lumenera, Photometrics, and Princeton […]

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10th Jan 2023

Teledyne e2v releases Hydra3D+, the first high resolution ToF sensor to work in all light conditions without motion artefacts

Grenoble, FRANCE, 10th January, 2023 — Teledyne e2v, a part of Teledyne Technologies [NYSE: TDY] announces the release of its Hydra3D+, a new Time-of-Flight (ToF) CMOS image sensor which incorporates 832 x 600 pixel resolution and is tailored for versatile 3D detection and measurement. Designed with Teledyne e2v’s proprietary CMOS technology, Hydra3D+ features a brand-new […]

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