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Teledyne e2v’s CMOS image sensors and subsystems deliver high performance across many applications. Teledyne e2v’s unique approach involves listening to the market and application challenges of customers and partnering with them to provide innovative standard, semi-custom or fully custom imaging solutions.

17th Jan 2023

Teledyne to present its newest scientific imaging and machine vision solutions at SPIE’s Photonics West exhibition

Teledyne will showcase their newest products and solutions at SPIE’s Photonics West exhibition taking place January 31 – February 2nd, 2023, in San Francisco, California. Visitors to the Teledyne booth #1527 can expect representation from the businesses within its Imaging group, including Teledyne DALSA, e2v, FLIR, Imaging Sensors, Acton Optics, Judson,  Lumenera, Photometrics, and Princeton […]

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10th Jan 2023

Teledyne e2v releases Hydra3D+, the first high resolution ToF sensor to work in all light conditions without motion artefacts

Grenoble, FRANCE, 10th January, 2023 — Teledyne e2v, a part of Teledyne Technologies [NYSE: TDY] announces the release of its Hydra3D+, a new Time-of-Flight (ToF) CMOS image sensor which incorporates 832 x 600 pixel resolution and is tailored for versatile 3D detection and measurement. Designed with Teledyne e2v’s proprietary CMOS technology, Hydra3D+ features a brand-new […]

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24th Nov 2022

VISION Focus article – Standard CMOS sensors applied to 3D vision, detection, and measurement

3D imaging technology has been around for several decades, but the first products were only commercialized in the 2000s when major film studios released movies in 3D using the latest HD video cameras. 3D vision increases the autonomy and effectiveness of robots/machine systems in the factory automation market, proving essential for higher accuracy quality inspection, […]

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