Teledyne Imaging New Technology Showcase, 17-19 Nov 2020

26th October 2020

6 Industrial Imaging Technology Sessions,
1 Must Attend Virtual Event

17-19 November 2020

While Covid-19 has forced the cancellation of tradeshows and conferences around the world, our product development team hasn’t slowed at all. Over the last six months, we’ve introduced dozens of new imaging components, driving significant advances in key industrial vision segments; including machine learning and AI; extreme high-resolution and high-speed imaging; 3D sensing; multi-spectral imaging; and high-volume, low-cost CMOS sensors. Please join us for this multi-session, virtual event to learn about the newest and most innovative imaging solutions from Teledyne including these sessions discussing Teledyne e2v’s CMOS sensor technology:

New Advances in 3D Sensing – Wednesday 18 November, 10:30 (ET)
Ha Lan Do Thu – Marketing Manager, Teledyne e2v
Sergio Morillas – Business Manager, Teledyne e2v
Inder Kohli – Senior Product Manager, Teledyne DALSA

Evolving CMOS Sensor Technology – Thursday 19 November, 10:30 (ET)
Florian Julien – Business Manager, Teledyne e2v
Marie-Charlotte Leclerc – Product Manager, Teledyne e2v

Find out more and register.