Capabilities
Capabilities
From standard to fully custom products, to fit all of your needs.
1D
2D
3D
From wafers to integrated systems 65nm, 180nm fab processes
From hundreds to
> 2 million units a year
Linear up to 32K
Area up to 67M
From 1.12 µm to 10 x 200 µm
From 30 to 3 million fps
From X-ray, visible to NIR*
*NIR: a unique photodiode and process exclusive to Teledyne e2v
3T, 4T, 5T, 6T and rolling or global shutter
CLCC, PGA, COB, (CSP, Fan-out)
SP1/12C
USB 2
USB 3
Multiple ROI
Binning
Subsampling
Gating for ToF or range gating
Ultra low noise
HDR mode
Single photon sensitivity
FPN & defective pixel correction
Stitching
Low light, BSI