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Teledyne e2v CMOS Image Sensors

Grenoble, FRANCE/Seville, SPAIN, May 21, 2021 — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and part of the Teledyne Imaging group, has been recognized as being amongst the best in machine vision by the judges of the Vision Systems Design 2021 Innovators Awards program. Teledyne e2v won Silver Awards for its Flash CMOS sensor and 2M Multi-focus Optical Module, and a Bronze Award in recognition of its Hydra3D CMOS sensor. The judging panel consisted of esteemed experts from system integrator and end-user companies.

“The Vision Systems Design team would like to congratulate Teledyne e2v for their awards in the 2021 Innovators Awards program,” says Chris Mc Loone, Editor in Chief. “Each year this unbiased and increasingly competitive program aims to celebrate the most innovative products and systems in machine vision. The Teledyne e2v team should be very proud.”

Vincent Hector, Vice President of Market Development at Teledyne e2v, says, “Listening, listening and listening; these three products are all dedicated to specific applications and have been designed by working closely with our customers, who are often leaders in their markets. Connecting technical experts to products users is always a source of innovation and we are very proud that the results are such, that these products have been recognized by Vision Systems Design.”

Notes to Editors:

For media enquiries, please contact:

[email protected]

Teledyne e2v is part of the Teledyne Imaging Group. Their innovations lead developments in healthcare, life sciences, space, transportation, defence and security and industrial markets. Teledyne e2v’s unique approach involves listening to the market and application challenges of customers and partnering with them to provide innovative standard, semi-custom or fully custom imaging solutions, bringing increased value to their systems.

For more information, visit imaging.teledyne-e2v.com

Teledyne Imaging is a group of leading-edge companies aligned under the Teledyne umbrella. Teledyne Imaging forms an unrivalled collective of expertise across the spectrum with decades of experience. Individually, each company offers best-in-class solutions. Together, they combine and leverage each other’s strengths to provide the deepest, widest imaging and related technology portfolio in the world. From aerospace through industrial inspection, scientific research, spectroscopy, radiography and radiotherapy, geospatial surveying, and advanced MEMS and semiconductor solutions, Teledyne Imaging offers world-wide customer support and the technical expertise to handle the toughest tasks. Their tools, technologies, and vision solutions are built to deliver to their customers a unique and competitive advantage.

About the Vision Systems Design 2021 Innovators Awards
The Vision Systems Design 2021 Innovators Awards program reviews and recognized the most innovative products and services in the vision and image processing industry. Criteria used in the Innovators Awards ranking included: originality, innovation; impact on designers, systems integrators and end-users; fulfilling a need in the market that hasn’t been addressed, leveraging a novel technology, and increasing productivity.

Live demos highlighting new AI and deep learning solutions at the booth

Shanghai, China, March 4, 2021 — Teledyne Imaging will exhibit at the upcoming Vision China (Shanghai), in Hall W1, W1-1800, at the Shanghai New International Expo Centre from March 17-19.

Visitors to the combined Teledyne Imaging booth can expect to see a broad range of leading-edge line and area scan sensors, frame grabbers, vision systems, software, and smart cameras targeted at vision inspection, logistics, robotics and packaging applications. Here are the highlights:

1. Line Scan Cameras & Embedded Vision

• The industry’s first Multifield™ CMOS TDI camera, Teledyne DALSA’s award-winning Linea HS captures brightfield, darkfield, and backlit images at once in a single scan. When combined with the Xtium™2 CLHS high-performance frame grabbers, these models achieve unmatched data throughput.
• Linea Lite is the newest addition to the Linea family, the Linea Lite brings high performance in a small package.
• Featured “live demo” of the Z-Trak 3D scanners that support up to 16 3D sensors, help remove occlusion and deliver real-time height measurement using laser triangulation and robust In-line measurement.
• Sherlock8 – next generation vision application software with support for 1D, 2D, 3D and thermal cameras. Includes support for “rules based” and “learning based” AI deep learning vision tools, parallel processing, factory protocols and custom user interfaces.
• VICORE – New Generation Smart Camera system supports up to 25M. The VICORE system has integrated software, I/O, PLC support and can handle traditional 2D and 3D, as well as infrared inspections.
• BOA Spot-XL – New Smart sensor is easy to use and contains all vision functionalities from gauging, flaw detection and robotic guidance to product identification (1D/2D/OCR).

2. Smart Sensors

• Teledyne e2v’s Emerald™ 67M image sensor achieves ultra-high resolution for electronics inspection, high-end surveillance and aerial imaging. Its 8K square resolution combined with its high frame rate enables increased throughput and improved detection ratio.
• The new high resolution Hydra3D™ Time-of-Flight CMOS image is tailored for 3D detection and distance measurement. It features a 10 µm three-tap cutting-edge pixel and supports the latest industrial applications, including vision guided robotics, logistics and automated guided vehicles.

3. sCMOS cameras

• Teledyne Photometrics features its latest back-illuminated sCMOS cameras Prime BSI Express and Kinetix. Both achieve 95% quantum efficiency, low read noise and extremely high speed (95 fps for Prime BSI Express and 500fps for Kinetix, full frame).
• Prime BSI Express camera’s small form factor and USB interface make it fit into the broadest range of configurations.
• Kinetix camera’s 10-megapixel sensor provides a 29.4 mm field of view, opening up possibilities for new discoveries.

4. Area scan cameras

• Teledyne’s first CXP camera, designed for performance and built on Genie Nano’s proven, industry-leading reputation.
• Teledyne Lumenera’s new Lt Series Cameras provides high performance USB3 models, from 2 to 20 Mpixels, in both board level and enclosed versions.

Subject matter experts will be on hand to discuss planned product development and advanced, enabling technology for your vision challenges.

Media Note: For interview requests, please email [email protected] or visit our booth in Hall W1, W1-1800 during the show.

About Teledyne Imaging 
Teledyne Imaging is a group of leading-edge companies aligned under the Teledyne umbrella. Teledyne Imaging forms an unrivalled collective of expertise across the spectrum and decades of experience. Individually, each company offers best-in-class solutions. Together, they combine and leverage each other’s strengths to provide the deepest, widest imaging and related technology portfolio in the world. From aerospace through industrial inspection, microscopy, spectroscopy, radiography and radiotherapy, geospatial surveying, and advanced MEMS and semiconductor solutions, Teledyne Imaging offers world-wide customer support and the technical expertise to handle the toughest tasks. Their tools, technologies, and vision solutions are built to deliver to their customers a unique and competitive advantage.

Media Contact:
Yuki Chan, Marketing Manager, Teledyne e2v
[email protected]

Grenoble, FRANCE, March 2, 2021 —Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces a new technology and industrial collaboration with Yumain (Dijon, France), a leading AI vision solution provider serving a broad range of industrial applications. Together, the companies will develop cutting-edge bio-inspired vision solutions that can enable innovation in industrial applications.

The recent emergence of AI for industry has rapidly demonstrated its benefits over traditional rule-based methods which have been proven to be unsuitable for applications with high variability e.g. the inspection of complex surfaces with irregularities (brushed aluminum, wood etc.). Yet to be harnessed to its full potential and for AI to be adopted globally, it must be easily setup and trained, optimized by users within minutes (without any AI expertise), provide reliable results, be flexible in application, secure, and low power. By joining forces, Teledyne e2v and Yumain plan to develop significant breakthrough innovations to address these challenges, make AI technology more accessible, and advance it to the next level.

Vincent Hector, Vice President of Market Development at Teledyne e2v, says, “We’re very excited to be collaborating with Yumain on this innovative project. Our image sensor capability coupled with their tailored AI expertise will allow us to develop AI-based vision solutions which will be easily accessible for industrial customers and bring real benefits to their applications.”

Marc Benoit, Managing Director of Yumain, commented, “Edge AI, as we know it today, consists of an optimization of machine learning models and computation inherited from the cloud. We have 10 years of experience in this field, which has shown us that alternative implementations of AI could be more suitable and scalable for the constraints of factory and production lines. Teledyne e2v’s image sensor design and production expertise are paramount to bringing these novel ideas to reality. This initiative is a key milestone for us and one that emphasizes our potential to investors.”

For media enquiries, please contact:
[email protected] | + 44 (0)1245 453607

Notes to Editors:

Teledyne e2v is part of the Teledyne Imaging Group. Their innovations lead developments in healthcare, life sciences, space, transportation, defence and security and industrial markets. Teledyne e2v’s unique approach involves listening to the market and application challenges of customers and partnering with them to provide innovative standard, semi-custom or fully-custom imaging solutions, bringing increased value to their systems. For more information, visit imaging.teledyne-e2v.com

Yumain, is a private company based in Dijon, France. Founded in 2011 by an experienced management and academic team, they design and manufacture intelligent vision systems and cameras for Industry 4.0. By leveraging a background in Artificial Intelligence and software and hardware design they serve international clients by focusing on predictive maintenance, quality control, industrial robots and risk prevention. Their approach is based on a unique analysis and real-time decision making process which is made directly from an image. This is acknowledged as a key achievement by their customers and has also received multiple awards from their peers. For more information, visit www.yumain.fr/en/home

Teledyne Imaging is a group of leading-edge companies aligned under the Teledyne umbrella. Teledyne Imaging forms an unrivalled collective of expertise across the spectrum with decades of experience. Individually, each company offers best-in-class solutions. Together, they combine and leverage each other’s strengths to provide the deepest, widest imaging and related technology portfolio in the world. From aerospace through industrial inspection, scientific research, spectroscopy, radiography and radiotherapy, geospatial surveying, and advanced MEMS and semiconductor solutions, Teledyne Imaging offers world-wide customer support and the technical expertise to handle the toughest tasks. Their tools, technologies, and vision solutions are built to deliver to their customers a unique and competitive advantage. For more information, visit www.teledyneimaging.com

New 2MP Global Shutter MIPI module will enhance productivity and throughput

Grenoble, FRANCE, September 8, 2020 — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces that it has expanded its product portfolio with a 2 Megapixel compact module featuring a pre-focused, industrial-grade scanning optic. This MIPI interfaced module finds a variety of uses in scanning, embedded vision and many other computer vision applications to enhance productivity and throughput in logistics, sorting, retail POS, and many other industrial sectors.

The 2MP optical module includes our small, state-of-the-art Snappy 2MP CMOS sensor which features a 2.8 µm low-noise global shutter pixel. Designed specifically for scanning and embedded vision applications, the sensor includes our patented Fast Self-Exposure™ mode that ensures the first, and all subsequent frames, are correctly exposed, this enables the fastest possible decoding/image processing by the downstream digital system, even in rapidly changing light conditions. The module has a 20 mm x 20 mm x 16 mm mechanical outline and is fitted with a custom-designed, high depth of field, high quality lens for applications that typically require a greater working range. Semi-customization is possible when alternative optical specifications are required.

As a turnkey sensor/optics for imaging systems, this 2MP module offers customers significant reduction in development time and cost savings. Only a few screws are needed to mount the module, with simple connection to the image processing system through an FPC cable connector. Software development efforts can also be reduced by using some limited API-layer Linux software drivers. This enables the module to be seamlessly interfaced to popular ISP platforms.

Gareth Powell, Senior Marketing Manager at Teledyne e2v, said, “This 2MP optical module is an exciting launch and the fore-runner in a family of MIPI modules. It provides customers with a solution to significantly reduce their integration times and shorten their time to market.”

Datasheets, user-guides, evaluation kits and samples are now available.

Please visit the product page or contact us for more information.

For media enquiries, please contact:

[email protected] | + 44 (0)1245 453607

Notes to Editors:

Teledyne e2v is part of the Teledyne Imaging Group. Their innovations lead developments in healthcare, life sciences, space, transportation, defence and security and industrial markets. Teledyne e2v’s unique approach involves listening to the market and application challenges of customers and partnering with them to provide innovative standard, semi-custom or fully-custom imaging solutions, bringing increased value to their systems.

For more information, visit imaging.teledyne-e2v.com

Teledyne Imaging is a group of leading-edge companies aligned under the Teledyne umbrella. Teledyne Imaging forms an unrivalled collective of expertise across the spectrum with decades of experience. Individually, each company offers best-in-class solutions. Together, they combine and leverage each other’s strengths to provide the deepest, widest imaging and related technology portfolio in the world. From aerospace through industrial inspection, scientific research, spectroscopy, radiography and radiotherapy, geospatial surveying, and advanced MEMS and semiconductor solutions, Teledyne Imaging offers world-wide customer support and the technical expertise to handle the toughest tasks. Their tools, technologies, and vision solutions are built to deliver to their customers a unique and competitive advantage.

For more information, visit www.teledyneimaging.com

New Hydra3D CMOS image sensor provides best-in-class 3D performance for robotics, logistics, automated guided vehicles and outdoor applications

Grenoble, FRANCE, July 30, 2020 — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces Hydra3D™, its new Time-of-Flight (ToF) CMOS image sensor, tailored for 3D detection and distance measurement. The sensor supports the latest industrial applications, including vision guided robotics, logistics and automated guided vehicles. Hydra3D’s high resolution and flexible configuration, combined with its on-chip HDR, make it ideal for outdoor applications such as surveillance, ITS, building construction and drones.

The sensor features a 10 µm three-tap cutting-edge pixel, designed with Teledyne e2v’s proprietary CMOS technology and produced by Tower Semiconductor, the leader in high-value analog semiconductor foundry solutions. Incorporating a resolution of 832 x 600 pixels, Hydra3D provides very fast transfer times starting from 20ns, excellent demodulation contrast and sensitivity. The sensor can be operated in real-time at short, mid and long-range distances, in both indoor and outdoor conditions, while providing excellent temporal precision.

Hydra3D uniquely combines outstanding performances and highly flexible design, offering customers:

• Reliable 3D detection of fast-moving scenes and real-time decisions due to its innovative three-tap pixel, so there is no motion blur and a depth map of over 30 fps
• A large field-of-view scene captured in both 2D and 3D which makes the system very cost effective
• Outstanding adaptability in various scenarios, in all light conditions. Together with its unique on-chip HDR feature, the sensors’ flexible configuration allows a trade-off between distance range, object reflectivity, frame rate, etc. as well as being robust to the ambient light
• Robust multiple ToF system operation because of our unique on-chip feature, enabling unsynchronized systems to work simultaneously without interfering with each other

Ha Lan Do Thu, Marketing Manager for 3D imaging at Teledyne e2v said, “We are very pleased to announce our newest Time-of-Flight sensor, the first multi-tap high resolution sensor in the market. Our partnership with Tower allows us to provide customers with the highest level of 3D performance, including uncompromised image quality in both 2D and 3D mode, in all operation conditions.”

Hydra3D comes with an evaluation kit (Hydra3D EK), enabling customers to evaluate the sensor in multiple application setups. The kit includes a compact 2/3-inch optical format calibrated module, which includes a light source for near infrared illumination and an optic. Two versions will be available targeted at performing the Time-of-Flight principle at short-range distances (up to 5 metres) or mid-range distances (up to 10 metres) and with a field-of-view of 60° x 45° or a field of view of 40° x 30°, while capturing real-time 3D information at a full resolution. In addition, several proprietary modelling tools have been developed and are available to support customers in the assessment of Hydra3D’s operation.

Rafael Romay, Vice President of Professional Imaging at Teledyne e2v, said: “The great technology innovation and partnership with Tower has been key in the development of this innovative new ToF image sensor, helping us to bring to market this best-in-class solution.”

Dr. Avi Strum, Senior VP and GM of Sensors and Display BU at Tower, added “We are very excited about the release of Hydra3D. Our strong partnership with Teledyne e2v goes back more than 15 years and many of their state-of-the-art products are manufactured by Tower. The Hydra3D ToF product is aligned well with Tower’s strategic investment in the ToF market. We look forward to many other Teledyne e2v products utilizing our world class CIS technology.”

Samples will be available in August 2020 and evaluation kits will be available in September 2020. Please visit the product page or contact us for more information.

For media enquiries, please contact:

[email protected]

Notes to Editors:

Teledyne e2v is part of the Teledyne Imaging Group. Their innovations lead developments in healthcare, life sciences, space, transportation, defence and security and industrial markets. Teledyne e2v’s unique approach involves listening to the market and application challenges of customers and partnering with them to provide innovative standard, semi-custom or fully-custom imaging solutions, bringing increased value to their systems.

For more information, visit imaging.teledyne-e2v.com

Teledyne Imaging is a group of leading-edge companies aligned under the Teledyne umbrella. Teledyne Imaging forms an unrivalled collective of expertise across the spectrum with decades of experience. Individually, each company offers best-in-class solutions. Together, they combine and leverage each other’s strengths to provide the deepest, widest imaging and related technology portfolio in the world. From aerospace through industrial inspection, scientific research, spectroscopy, radiography and radiotherapy, geospatial surveying, and advanced MEMS and semiconductor solutions, Teledyne Imaging offers world-wide customer support and the technical expertise to handle the toughest tasks. Their tools, technologies, and vision solutions are built to deliver to their customers a unique and competitive advantage.

For more information, visit www.teledyneimaging.com

Grenoble, FRANCE, June 16, 2020 — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announced today that its Emerald™ 67M CMOS image sensor was recognized among the best in the industry by the judges of the Vision Systems Design 2020 Innovators Awards program. The judging panel consisted of experts from system integrator and end-user companies.

“The Vision Systems Design team would like to congratulate Teledyne e2v for being publicly recognized by the esteemed judging panel of the 2020 Innovators Awards program,” says John Lewis, Editor in Chief. “Each year this unbiased and increasingly competitive program aims to celebrate the most innovative products and systems in machine vision, and the Teledyne e2v team should be very proud of their accomplishment.”

Emerald 67M is a high-resolution and high-speed global shutter CMOS sensor providing low noise performance (3e- readout noise), compact APS-C format and high frame rate (up to 65fps at full resolution). The sensor features Tower’s smallest in the world 2.5µm low-noise global shutter pixel, on Tower’s 65nm platform, in its Uozu, 300mm Japanese manufacturing facility. This 67-megapixel sensor is able to meet the demands of the most challenging industries, including flat panel display and electronics inspection as well as applications outside the factory floor such as sports broadcasting. Reaching frame frequencies of up to 120Hz @10bits and 60Hz @12bits in an 8K UHD format, Emerald 67M is ready to tackle the challenges of tomorrow’s 8K UHD imaging.

Marie-Charlotte Leclerc, Marketing Manager at Teledyne e2v, comments, “We are very proud to see our technical expertise and ever-increasing innovation recognized. Our partnership with Tower enabled us to bring to market this best-in-class solution, and this Silver Innovators Award is testament to our focus on the ambitions of our customers – the application specialists and end-users. Emerald 67M, in particular, is a great example of this partnership between innovation and customer intimacy that is so important to Teledyne e2v.”

For more information on Emerald 67M visit the product page or contact us.

For media enquiries, please contact:

[email protected]

Notes to Editors:

Teledyne e2v is part of the Teledyne Imaging Group. Their innovations lead developments in healthcare, life sciences, space, transportation, defence and security and industrial markets. Teledyne e2v’s unique approach involves listening to the market and application challenges of customers and partnering with them to provide innovative standard, semi-custom or fully-custom imaging solutions, bringing increased value to their systems.

For more information, visit imaging.teledyne-e2v.com

Teledyne Imaging is a group of leading-edge companies aligned under the Teledyne Technologies [TDY] umbrella. Teledyne Imaging forms an unrivalled collective of expertise across the spectrum with decades of experience. Individually, each company offers best-in-class solutions. Together, they combine and leverage each other’s strengths to provide the deepest, widest imaging and related technology portfolio in the world. From aerospace through industrial inspection, radiography and radiotherapy, geospatial surveying, and advanced MEMS and semiconductor solutions, Teledyne Imaging offers world-wide customer support and the technical expertise to handle the toughest tasks. Their tools, technologies, and vision solutions are built to deliver to their customers a unique and competitive advantage.

For more information, visit www.teledyneimaging.com

About Vision Systems Design
Published since 1995, Vision Systems Design is a global resource for engineers, engineering managers and systems integrators that provides comprehensive global coverage of vision systems technologies, applications, and markets. Vision Systems Design’s magazine, website (www.vision-systems.com), email newsletters and webcasts report on and analyze the latest technology and business developments and trends in the worldwide machine vision and image processing industry.

About The Vision Systems Design 2020 Innovators Awards program
The Vision Systems Design 2020 Innovators Awards program reviews and recognized the most innovative products and services in the vision and image processing industry. High-scoring companies were announced via webcast on June 16th. Criteria used in the Innovators Awards ranking included: originality, innovation; impact on designers, systems integrators and end-users; fulfilling a need in the market that hasn’t been addressed, leveraging a novel technology, and increasing productivity.

Grenoble, FRANCE, April 28, 2020 — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces its new Emerald 3.2 Megapixel CMOS image sensor, specially designed to tackle the challenges of emerging applications such as security, drones and embedded vision, as well as traditional machine vision.

With its 2.8 µm global shutter pixel and innovative design, the new 3.2M sensor shares all of the characteristics of the Emerald sensor series: superior low-noise performance, compact format, easy integration and a wide range of embedded features.

The sensor has been designed in an ultra-compact light package format with low power to address the challenge of optimizing SWaP-C (Size, Weight, Power and Cost). The device also features a MIPI interface, that provides a direct connection to low-cost MIPI ISPs and a central optical center that helps to minimize the camera size. Its small pixel enables the sensor to fit within compact and cost-effective S-mount optics. In addition, Emerald 3.2M is pin-to-pin and optically compatible with Emerald 2M and Emerald 5M, so that multiple resolutions are supported from one single design, saving cost.

The Emerald 3.2M sensor is available in two different package options (ceramic LGA or organic fan-out BGA) to either optimize size and cost or prioritize robustness in harsh conditions. It offers versatility in terms of Chief Ray Angle (CRA) as well to ensure a perfect match with different kinds of optics.

This new sensor completes Teledyne e2v’s Emerald product portfolio which includes sensors in resolutions from 2 to 67 Megapixels.

Evaluation Kits and samples of Emerald 3.2M are now available.

Please visit the product page or contact us for more information.

For media enquiries, please contact:

[email protected] | + 44 (0)1245 453607

Notes to Editors:

Teledyne e2v is part of the Teledyne Imaging Group. Their innovations lead developments in healthcare, life sciences, space, transportation, defence and security and industrial markets. Teledyne e2v’s unique approach involves listening to the market and application challenges of customers and partnering with them to provide innovative standard, semi-custom or fully-custom imaging solutions, bringing increased value to their systems.

For more information, visit imaging.teledyne-e2v.com

Teledyne Imaging is a group of leading-edge companies aligned under the Teledyne Technologies [TDY] umbrella. Teledyne Imaging forms an unrivalled collective of expertise across the spectrum with decades of experience. Individually, each company offers best-in-class solutions. Together, they combine and leverage each other’s strengths to provide the deepest, widest imaging and related technology portfolio in the world. From aerospace through industrial inspection, radiography and radiotherapy, geospatial surveying, and advanced MEMS and semiconductor solutions, Teledyne Imaging offers world-wide customer support and the technical expertise to handle the toughest tasks. Their tools, technologies, and vision solutions are built to deliver to their customers a unique and competitive advantage.

For more information, visit www.teledyneimaging.com

GRENOBLE, France, January 14^th, 2020 — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces its new Emerald 36M, a 37.7 Megapixel image sensor specifically designed for demanding industrial and outdoor applications requiring both high resolution and high speed.

Emerald 36M uniquely combines 6k square resolution and superior frame rate, providing low noise, high quantum efficiency and wide angular response. It also offers excellent image quality that benefits the most challenging applications. The sensor is available in an ultra-high speed and a high-speed version, respectively providing 86fps and 43fps at full resolution.

The sensor is designed to provide easy integration and compatibility with cost-effective FPGAs. It comes in a ceramic µPGA package fitting standard Four Thirds optics, making it the world’s highest resolution global shutter sensor to fit these compact lenses. In addition, Emerald 36M is pin-to-pin and optically compatible with Emerald 67M, so that multiple resolutions and speed grades are possible from a single camera design.

Marie-Charlotte Leclerc, Marketing Manager at Teledyne e2v said, “We are delighted to release the Emerald 36M. The sensor is already gathering interest from vision system designers looking forward to improved accuracy and throughput with optimized inspection system paths. And beyond the factory floor, Emerald 36M enables surveillance over wider fields of view and provides higher autonomy for aerial mapping and security solutions.”

Evaluation kits and samples of Emerald 36M are available now.

Please visit the product page or contact us for more information.

For media enquiries, please contact:

[email protected] | + 44 (0)1245 453607

Notes to Editors:

Teledyne e2v is part of the Teledyne Imaging Group. Their innovations lead developments in healthcare, life sciences, space, transportation, defence and security and industrial markets. Teledyne e2v’s unique approach involves listening to the market and application challenges of customers and partnering with them to provide innovative standard, semi-custom or fully-custom imaging solutions, bringing increased value to their systems.

For more information, visit imaging.teledyne-e2v.com

Teledyne Imaging is a group of leading-edge companies aligned under the Teledyne Technologies [TDY] umbrella. Teledyne Imaging forms an unrivalled collective of expertise across the spectrum with decades of experience. Individually, each company offers best-in-class solutions. Together, they combine and leverage each other’s strengths to provide the deepest, widest imaging and related technology portfolio in the world. From aerospace through industrial inspection, radiography and radiotherapy, geospatial surveying, and advanced MEMS and semiconductor solutions, Teledyne Imaging offers world-wide customer support and the technical expertise to handle the toughest tasks. Their tools, technologies, and vision solutions are built to deliver to their customers a unique and competitive advantage.

For more information, visit www.teledyneimaging.com

New Bora 3D CMOS image sensor enables vision-guided robotics, logistics and surveillance

GRENOBLE, France, 12 November 2019 — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces its new Bora™ Time-of-Flight CMOS image sensor, tailored for 3D detection and distance measurement to support the latest industrial applications, including vision guided robotics, logistics and surveillance.

Based on an innovative 10µm pixel design and incorporating a resolution of 1280 x 1024 pixels, the Bora image sensor offers excellent sensitivity and a unique on-chip gated global shutter mode, which enables gating times of up to 42ns.

Bora’s highly flexible design allows:

• Greater adaptability to various scenarios, with precise 3D information detection and state-of-the-art 1.3MP depth resolution
• Scene capture with a large field-of-view in both 2D and 3D which enables cost effectiveness and system optimization, useful for static applications such as construction or architectural mapping
• Real-time 3D image capture with a depth map of over 30fps in a four-phase operation
• Robust reliability in challenging conditions, and short- and long-range capabilities which are immune to ambient light intrusions, using a unique HDR feature

The Bora sensor comes with an evaluation kit, comprised of a compact 1-inch optical format calibrated module, which includes a light source for near infrared illumination. It also includes optics targeted at performing the Time-of-Flight principle at short-range distances to 5m or mid-range distances to 10m, while capturing real-time 3D information at a full resolution of 1.3MP.

Ha Lan Do Thu, Marketing Manager for 3D imaging at Teledyne e2v said, “We are very pleased to announce our newest Time-of-Flight sensor, which provides customers with true 1.3MP depth resolution at more than 30 fps. The sensor uniquely achieves excellent precision and accuracy in 3D measurements and is highly flexible, handling both short- and long-range capture over 10 meters and in outdoor conditions.”

Samples and evaluation kits for short-range distances are now available. Evaluation kits for mid-range distances are available on demand. Please visit the product page or contact us for more information.

For media enquiries, please contact:

[email protected] | + 44 (0)1245 453607

Notes to Editors:

Teledyne e2v is part of the Teledyne Imaging Group. Their innovations lead developments in healthcare, life sciences, space, transportation, defence and security and industrial markets. Teledyne e2v’s unique approach involves listening to the market and application challenges of customers and partnering with them to provide innovative standard, semi-custom or fully-custom imaging solutions, bringing increased value to their systems.

For more information, visit imaging.teledyne-e2v.com

Teledyne Imaging is a group of leading-edge companies aligned under the Teledyne Technologies [TDY] umbrella. Teledyne Imaging forms an unrivalled collective of expertise across the spectrum with decades of experience. Individually, each company offers best-in-class solutions. Together, they combine and leverage each other’s strengths to provide the deepest, widest imaging and related technology portfolio in the world. From aerospace through industrial inspection, radiography and radiotherapy, geospatial surveying, and advanced MEMS and semiconductor solutions, Teledyne Imaging offers world-wide customer support and the technical expertise to handle the toughest tasks. Their tools, technologies, and vision solutions are built to deliver to their customers a unique and competitive advantage.

For more information, visit www.teledyneimaging.com

GRENOBLE, France, 3 September, 2019 — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces its Flash CMOS image sensor family, specifically tailored for 3D laser profiling/displacement applications and high speed, high resolution inspection.

The new Flash sensors feature a 6µm CMOS global shutter pixel which effectively combines high resolution and fast frame rate. They are available in a 4k or 2k horizontal resolution, with respective frame rates of 1800fps and 1500fps (8 bits), and respective readout speeds of 61.4Gbps and 25.6Gbps (the best Gbps/price ratio in the market). The sensors come in a µPGA ceramic package fitting in standard optical formats, APS-like optics in the 4k and C-Mount in the 2k.

Designed to enable easy and cost-effective integration for camera makers, the new sensors include a wide range of application-based features including:

• High Dynamic Range modes with up to 100dB that enables both the measurement and inspection of highly-reflective surfaces and dark areas in the same image
• Multiple Region of Interest mode that provides the ideal tradeoff between profiling rate and range/resolution in the height measurement
• Frame to frame ‘hot’ changes mode of some parameters (exposure time, binning, ROI, flipping and conversion time) that enables flexibility and real-time adaptation to the environment conditions
• Different trigger modes that allow customers to adapt, depending on the speed of production lines

Flash image sensors are available with a wide range of derivatives at sensor level, so that customers can differentiate to meet specific applications challenges. Examples include, multiple operating modes which trade-off between frame rate, power consumption and the number of bits, increasing frame rate by utilizing horizontal binning and the capability to optimally fit the Scheimpflug angle required for your specific application.

Yoann Lochardet, Marketing Manager for 3D at Teledyne e2v said, “We are very pleased to announce the release of the new Flash family of CMOS sensors which were developed after listening closely to the requirements of leading companies in the market. These new sensors feature a unique set of characteristics targeted at 3D laser triangulation applications including; high resolution, very high frame rate, very high readout speed, HDR capability and a large set of additional features. All these capabilities allow our customers to solve the most challenging application demands in 3D laser profiling/displacement such as quality control and 3D measurement.”

Evaluation Kits and samples of Flash 2K and Flash 4K are now available. Please visit the product page or contact us for more information.

For media enquiries, please contact:

[email protected] | + 44 (0)1245 453607

Notes to Editors:

About Teledyne e2v
Teledyne e2v is part of the Teledyne Imaging Group. Their innovations lead developments in healthcare, life sciences, space, transportation, defence and security and industrial markets. Teledyne e2v’s unique approach involves listening to the market and application challenges of customers and partnering with them to provide innovative standard, semi-custom or fully-custom imaging solutions, bringing increased value to their systems. For more information  imaging.teledyne-e2v.com

About Teledyne Imaging 
Teledyne Imaging is a group of leading-edge technology companies aligned within the Teledyne brand. With unrivalled expertise across the electromagnetic spectrum and decades of experience, the group offers world-leading capabilities in sensing, signal generation and processing. The collective delivers innovative solutions to aerospace, defense, geospatial, machine and industrial vision, medical and life sciences, semiconductors and MEMs. For more information, visit teledyneimaging.com