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Teledyne e2v CMOS Image Sensors

Grenoble, FRANCE, 28 February, 2023 — Teledyne e2v, a part of Teledyne Technologies [NYSE: TDY], announces the release of Optimom 1.5M, the latest member of the Optimom™ family, a new range of turnkey optical modules that can be instantly integrated into vision systems.

Optimom 1.5M is a complete board-level vision extension made to accelerate development time, reduce R&D investment, and scale down manufacturing costs for embedded vision and AI vision solutions. It comprises of a proprietary image sensor, a tiny 25mm square board with lens mount, and optional lens in various options.

Featuring a native MIPI CSI-2 protocol, the Optimom 1.5M module is provided with a complete development kit, which includes adapter board, cabling, and Linux drivers for instant integration with MIPI-based processing units such as NVIDIA Jetson or NXP i.MX solutions.

Featuring a 1.5 Megapixel CMOS image sensor, Optimom 1.5M provides a wide 1,920 x 800 format ideal for scanning applications such as handheld scanners, auto ID systems, laboratory equipment, or drones. The module comes with an adapted price point for 1.5MP solutions, while ensuring full compatibility with the higher resolution Optimom 2M module.

Both modules can be supplied with a lens already installed and focused, eliminating the tedious task of lens selection and assembly. The additional Auto Focus lens option also enables customers to benefit from an extended depth of focus even at close distances and can be combined with various Multi Focus or Auto Focus algorithms.

The Optimom modules will be showcased in a live demonstration at Embedded World, Nürnberg, Germany from 14-16^th March. Visit us on Teledyne stand 2-644 or contact us online to get more information about product capabilities and customization options.

Documentation, samples, and kits for evaluation or development are available upon request.

About Teledyne e2v

Teledyne e2v innovations lead developments in healthcare, life sciences, space, transportation, defense and security and industrial markets. Teledyne e2v’s unique approach involves listening to the market and application challenges of their customers and partnering with them to provide innovative standard, semi-custom or fully custom imaging solutions, bringing increased value to their systems.

For more information, visit imaging.teledyne-e2v.com

Teledyne e2v media enquiries contact:

[email protected]

Teledyne will showcase their newest products and solutions at SPIE’s Photonics West exhibition taking place January 31 – February 2^nd, 2023, in San Francisco, California.

Visitors to the Teledyne booth #1527 can expect representation from the businesses within its Imaging group, including Teledyne DALSA, e2v, FLIR, Imaging Sensors, Acton Optics, Judson,  Lumenera, Photometrics, and Princeton Instruments.

New products introduced include:

• Teledyne e2v has released its Hydra3D+, the first high resolution Time-of-Flight (ToF) CMOS image sensor to work in all light conditions without motion artefacts. It incorporates 832 x 600 pixel resolution and is tailored for versatile 3D detection and measurement.
• Teledyne FLIR will present its new Forge 5GigE area scan cameras. Forge cameras deliver the industry’s fastest frame rates with burst mode at speeds up to 10Gb/s and an impressive 500 MB image buffer for managing data transfer. Sensor lineup starts with 5 to 24 MP Sony Pregius S.  See a live demo.
• Teledyne Imaging Sensors will display the closed-cycle Catalina camera, which uses a dual pulse tube cooler to maintain continuous operations at 80K for the MCT sensor, providing a spectral response from 2.0 to 12.3 microns with a frame rate of 1610 Hz and a 128×128 pixel window size. This design provides the ability to manipulate integration times, frame times, and cold filters to meet the most precise testing requirements.
• Teledyne Photometrics will introduce the Retiga E20 high resolution, high pixel count CMOS camera, with ideal spatial sampling for lower magnifications. E20 is back illuminated for great light collection, and is excellent for long exposures due to its very low dark current. It has a compact form factor for easy integration in applications including chemiluminescence imaging, immunofluorescence imaging, high content screening, and low light device inspection.
• Teledyne Princeton Instruments will feature its COSMOS™ large format, deep-cooled, high performance CMOS camera designed and manufactured entirely within a single source. With proprietary LACera™ technology, the COSMOS offers greater than 90% quantum efficiency, up to 8k x 8k sensor sizes, and proprietary low noise architecture with up to 18-bit readout and fast frame rate of up to 50 fps full frame.

Additionally, Teledyne’s businesses will provide 10-minute flash talks in a presentation area at the front of the Teledyne booth. Stop by to learn more about hyperspectral imaging, imaging challenges in photonics, new technology and applications for CMOS detectors, requirements for thermal sensitivity, comparisons of 3D sensors, and more. Our product specialists will be available to discuss your specific requirements.

Teledyne offers a global powerhouse of advanced technology companies aligned under its  Teledyne Imaging umbrella. These companies form an unrivalled collective of expertise across the spectrum with decades of experience and best-in-class solutions. Together, they combine and leverage each other’s strengths to provide the deepest, widest sensing and related technology portfolio in the world. From aerospace through industrial inspection, scientific research, spectroscopy, radiography and radiotherapy, geospatial surveying, and advanced MEMS and semiconductor solutions, Teledyne offers worldwide customer support and the technical expertise to handle the toughest tasks. Their tools, technologies, and vision solutions are built to deliver to their customers a unique and competitive advantage.

Editorial contact:

Geralyn Miller, Global Media Relations
Teledyne
[email protected]

Grenoble, FRANCE, 10^th January, 2023 — Teledyne e2v, a part of Teledyne Technologies [NYSE: TDY] announces the release of its Hydra3D+, a new Time-of-Flight (ToF) CMOS image sensor which incorporates 832 x 600 pixel resolution and is tailored for versatile 3D detection and measurement.

Designed with Teledyne e2v’s proprietary CMOS technology, Hydra3D+ features a brand-new 10 µm three-tap pixel which provides very fast transfer times (starting from 10ns), and displays high sensitivity in the NIR wavelength, alongside excellent demodulation contrast. This precise combination enables the sensor to operate in real-time without motion artefacts (even if there are fast moving objects in the scene) and with excellent temporal noise at short ranges, essential in applications such as pick and place, logistics, factory automation and factory safety. An innovative on-chip multi-system management feature enables the sensor to work alongside multiple active systems without interference which can lead to false measurements.

The excellent sensitivity of Hydra3D+ enables it to effectively manage lighting power and handle a wide range of reflectivity. It’s high resolution, with powerful on-chip HDR, featuring an on-the-fly flexible configuration, enables the best trade-off between application-level parameters, such as distance range, object reflectivity, frame rate etc. This makes it ideal for mid, long-range distances and/or outdoor applications such as automated guided vehicles, surveillance, ITS and building construction.

The sensor has been thoughtfully designed for customers seeking real-time and flexible 3D detection with uncompromised 3D performance. It offers large field-of-view scenes captured in both 2D and 3D by a compact sensor which makes the system very cost effective.

Ha Lan Do Thu, Marketing Manager for 3D imaging at Teledyne e2v said, “Today, many Time-of-Flight sensors suffer from motion artefacts and can’t instantly perform in changing operating conditions. With Hydra3D+, our customers can easily achieve reliable 3D measurement with the highest levels of 3D performance, uncompromised image quality in both 2D and 3D modes, and in all distance ranges and conditions even where multiple systems operate or in outdoor environments.”

Documentation, samples, and development tools are now available upon request. In addition, there are several proprietary modelling tools to support customers in their assessment of the operation of Hydra3D+.

About Teledyne e2v

Teledyne e2v innovations lead developments in healthcare, life sciences, space, transportation, defense and security and industrial markets. Teledyne e2v’s unique approach involves listening to the market and application challenges of their customers and partnering with them to provide innovative standard, semi-custom or fully custom imaging solutions, bringing increased value to their systems.

For more information, visit imaging.teledyne-e2v.com

Teledyne e2v media enquiries contact:

[email protected]

Teledyne’s DALSA, e2v, FLIR and  Lumenera businesses will display the world’s most comprehensive, vertically integrated portfolio of industrial imaging technology. Visit Teledyne in Hall 8, B10 and explore unmatched capabilities and products from your one source for unlimited vision solutions partner.

Teledyne will participate in the Industrial Vision Days with keynote and technology presentations:

• “VDMA Panel Discussion: How smart are smart 2D/3D sensors?” October 4, 1 pm with Teledyne Vision Solutions’ Martin Klenke

• “Cameras Unite! What happens when great camera lines join forces?” Wednesday, 5 October, 2 pm with Teledyne FLIR’s Riana Sartori
• “Multi-Information Imaging Technologies” Thursday, 6 October, 11:20 am with Teledyne DALSA’s Matthias Sonder
• “Tips on Finding the Right Optics for your Image Sensor” Thursday, 6 October, 3 pm with Teledyne e2v’s Marie-Charlotte Leclerc

New products introduced by Teledyne companies will include:

• Teledyne e2v’s newly released 2-Megapixel Optimom™ is the first in a series of MIPI CSI-2 optical modules. Optimom’s proprietary sensor technology is designed to ensure rapid development for vision-based embedded systems for robotics, logistics, drones, or laboratory equipment.
• Teledyne DALSA’s AxCIS™ is a new family of high-speed and high-resolution fully integrated line scan imaging modules. These easy-to-use Contact Image Sensors (CIS) combine sensors, lenses, and lights and offer a lower cost inspection system for demanding machine vision applications.
• Vizor is a new 5 GigE area scan camera platform, the first to harness the combined technical expertise from Teledyne FLIR, DALSA, and Lumenera. It provides the richest combination of customer-led features for system engineers to build reliable and competitive products faster.
• Teledyne DALSA’s new Linea™2 4k Multispectral 5GigE offers 5x the bandwidth of the Linea GigE family with its 5GigE interface. The cameras are powered by our very own Teledyne quadlinear sensor, extending detection capability using RGB + NIR multispectral imaging technology.
• Based on Teledyne DALSA’s industry leading CMOS multi-array TDI technology, the new Linea™ HS 16k Backside Illuminated cameras significantly enhance sensitivity, particularly for UV imaging. The cameras come with next-generation CLHS interface, delivering up to 8.4 Gigapixels per second over a single active optical cable.
• Teledyne expands Genie™ Nano portfolio with industry’s smallest 67 Megapixel 10GigE Vision camera, the M/C8200, and a new 37 Megapixel M/C6200. Featuring e2v’s Emerald series of monochrome and color sensors, these new cameras are engineered for high-speed data capture and transfer, delivering a future-proof and scalable solution for vision system designers.
• The new Falcon4-CLHS M6200 and M8200 models based on Teledyne e2v’s Emerald 37M and 67M sensors feature higher resolution and added functionality with a CLHS interface designed for industrial imaging applications requiring high-speed data transfer. These cameras are engineered to reach thousands of FPS in either partial scan mode, or when using the Multi-ROI mode.

Teledyne product and application specialists will be available at the booth to demonstrate our new products and discuss your specific requirements.

Click here for an overview of featured products and demonstrations for Vision 2022.

For media enquiries, please contact:

Jessica Broom

[email protected]

About Teledyne

Teledyne’s Vision Solutions group form an unrivaled collective of imaging expertise across the spectrum. Individually, each company offers best-in-class solutions. Together, they combine to leverage each other’s strengths and provide the widest imaging technology portfolio in the world. From aerospace through industrial inspection, scientific research, spectroscopy, radiography and radiotherapy, and advanced MEMS and semiconductor solutions, Teledyne offers worldwide customer support and the technical expertise to handle the toughest tasks. Their vision solutions are built to deliver to their customers a unique and competitive advantage.

Grenoble, FRANCE, 6 September, 2022 — Teledyne e2v announces the release of its 2-Megapixel Optimom™, the first in a range of MIPI CSI-2 optical modules. Powered by Teledyne e2v’s proprietary image sensor technology, Optimom has been thoughtfully designed to ensure there is minimum development effort required for vision-based embedded systems for robotics, logistics, drones, or laboratory equipment.

Optimom™ 2M features a native MIPI CSI-2 protocol and standard FPC connector to link with embedded processing boards. Integration is instant using a dedicated Development Kit, which includes both an adapter board for hardware integration and Linux drivers for straightforward software integration with NVIDIA Jetson or NXP i.MX solutions.

These optical modules are built with the same compact 25 mm square outline, enabling a single mechanical design that can even fit into highly constrained mechanical systems. To address the requirements of various applications, Optimom 2M can be tailored for multiple scenarios with two color options (Monochrome or RGB) and three lens options (a multi-focus lens, a fix-focus lens, or without lens). The lens is supplied already installed and focused, eliminating the tedious task of lens selection and assembly.

All Optimom 2M models are powered by Teledyne e2v’s proprietary 2-Megapixel, low-noise, global shutter image sensor which provides sharp images of fast-moving objects. The multi-focus version of Optimom 2M combines a broad working distance and wide aperture in one solution by utilizing an innovative focus adjustment technology.

Marie-Charlotte Leclerc, Product Marketing Manager at Teledyne e2v, said, “The acceleration of product life cycles and the multiplication of vision-use cases leave vision system makers today with no choice but to invest less time and money in new developments and focus on their added value. Leveraging our core imaging expertise and long experience in customized solutions, Optimom 2M aims to address this very challenge with a ready-to-use imaging solution that can be fine-tuned for any project.”

Optimom 2M will be featured in a live demonstration at VISION Stuttgart from 4-6^th October. Visit us on Teledyne stand 8 B10 for more information. For a dedicated demonstration or confidential discussion, contact us online or through your usual point of contact.

Documentation, samples, and an evaluation kit are available now upon request.

About Teledyne e2v

Teledyne e2v’s innovations lead developments in healthcare, life sciences, space, transportation, defense and security and industrial markets. Teledyne e2v’s unique approach involves listening to the market and application challenges of customers and partnering with them to provide innovative standard, semi-custom or fully custom imaging solutions, bringing increased value to their systems.

For more information, visit imaging.teledyne-e2v.com

Teledyne e2v media enquiries contact:

[email protected]

Award-winning sensor utilizes Tower Semiconductor’s state-of-the-art 65nm, low noise, global-shutter pixel technology

Grenoble, FRANCE, and Migdal Haemek, ISRAEL, June 7, 2022 – Teledyne e2v announced today that its Topaz CMOS image sensors, utilizing Tower Semiconductor’s 65nm global shutter pixel technology, were recognized among the best in machine vision by the judges of the Vision Systems Design 2022 Innovators Awards program. The judging panel consisted of esteemed experts from system integrator and end-user companies.

“The Vision Systems Design team would like to congratulate Teledyne e2v for their score in the 2022 Innovators Awards program,” says Chris Mc Loone, Editor in Chief. “Each year this unbiased and increasingly competitive program aims to celebrate the most innovative products and systems in machine vision. The Teledyne e2v team should be very proud.”

Topaz is available in 2MP (1,920 x 1,080 pixel) and 1.5MP (1,920 x 800) resolutions and enables compact mobile designs for many applications. Housed in a tiny 4.45 mm wide Chip Scale Package (CSP), with an optical array centre precisely matched with the mechanical centre of the package also allows for a slim camera design. This makes the sensors particularly suitable for miniature OEM barcode engine designs, mobile terminals and sleds, IoT, contactless authentication systems, wearable devices, drones and robotics. The machine vision and data gathering camera market is growing at 7.4% rate and is expected to reach $5.5B by 2026 (source Yole Development, 2021).

Tower’s global shutter pixel technology is based on its leading and unique light pipe (a micro-optical structure that funnels the light directly into the photodiode) – technology which enables a significant decrease in pixel size, while still offering state-of-the-art functionality, superb angular response, outstanding Shutter Efficiency and Quantum Efficiency (QE).

Rafael Juarez Romay, Executive Vice President and General Manager of Teledyne e2v said, “Innovation brings real value when it’s adapted to customers’ needs. Topaz was developed to enhance productivity and throughput and provide longer working ranges in modern logistics, retail, and manufacturing applications. The sensors offer excellent cost/performance ratio and have a tiny footprint making them ideal to drive the world’s smallest barcode OEM engines and thinnest mobile platform. Tower Semiconductor has been our foundry of choice for all of our image sensors for almost two decades. Listening and designing a solution that will bring our customers the most value is in our DNA, so we are very proud to be recognized with this award.”

“We are proud to accompany Teledyne e2v as a long-term partner for nearly two decades in its CMOS image sensor innovations,” said Dr. Avi Strum, Senior Vice President and General Manager of the Sensors and Displays Business Unit at Tower Semiconductor. “The Topaz CMOS image sensor designs combined with our advanced 65nm CIS process is a significant milestone toward smaller and smarter industrial cameras. Our well-established collaboration with Teledyne e2v is a testimony of our commitment to support and promote industrial vision developments in this growing market”.

Samples and evaluation kits are available now. Please contact us for more information.

About Vision Systems Design

Published since 1996, Vision Systems Design is a global resource for engineers, engineering managers and systems integrators that provides comprehensive global coverage of vision systems technologies, applications, and markets. Vision Systems Design’s magazine, website (www.vision-systems.com), email newsletters and webcasts report on and analyze the latest technology and business developments and trends in the worldwide machine vision and image processing industry.

About the Vision Systems Design 2022 Innovators Awards

The Vision Systems Design 2022 Innovators Awards program reviews and recognizes the most innovative products and services in the vision and image processing industry. Criteria used in the Innovators Awards ranking included: originality; innovation; impact on designers, systems integrators, and end-users; fulfilling a need in the market that hasn’t been addressed; leveraging a novel technology; and increasing productivity.

About Teledyne e2v

Teledyne e2v’s innovations lead developments in healthcare, life sciences, space, transportation, defense and security and industrial markets. Teledyne e2v’s unique approach involves listening to the market and application challenges of customers and partnering with them to provide innovative standard, semi-custom or fully custom imaging solutions, bringing increased value to their systems.

For more information, visit imaging.teledyne-e2v.com

Teledyne e2v media enquiries contact:

[email protected]

About Tower Semiconductor         

Tower Semiconductor Ltd. (NASDAQ: TSEM, TASE: TSEM), the leading foundry of high value analog semiconductor solutions, provides technology and manufacturing platforms for integrated circuits (ICs) in growing markets such as consumer, industrial, automotive, mobile, infrastructure, medical and aerospace and defense. Tower Semiconductor focuses on creating positive and sustainable impact on the world through long term partnerships and its advanced and innovative analog technology offering, comprised of a broad range of customizable process platforms such as SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS image sensor, non-imaging sensors, integrated power management (BCD and 700V), and MEMS. For more information, please visit: www.towersemi.com

Tower Semiconductor Company Contact:

Orit Shahar | +972-74-7377440 | [email protected]

Hong Kong, China, October 5th, 2021 — Teledyne e2v and Teledyne DALSA, part of Teledyne Technologies companies [NYSE: TDY] and global leaders in machine vision technology, have been recognized for being amongst the best in machine vision by the judges of the Vision Systems Design China Innovators Awards 2021 program. Teledyne e2v received a Gold Award for its 2M Multi-focus Optical Module, and a Silver Award for its Hydra3D CMOS sensor, while Teledyne DALSA won Gold for its Linea HS 32K camera.

One of the greatest challenges in machine vision today is to increase imaging resolution while maintaining or even reducing system-level costs. The Linea HS 32k TDI camera provides an innovative solution to meet such contradictory requirements, and OEMs can readily integrate the new camera into existing systems to achieve much higher performance without needing to change optics.

The 2MP optical module includes our small, state-of-the-art Snappy 2MP CMOS sensor which features a 2.8 µm low-noise global shutter pixel. Designed specifically for scanning and embedded vision applications, the sensor includes our patented Fast Self-Exposure™ mode that ensures the first, and all subsequent frames, are correctly exposed, this enables the fastest possible decoding/image processing by the downstream digital system, even in rapidly changing light conditions. The module has a 20 mm x 20 mm x 16 mm mechanical outline and is fitted with a custom-designed, high depth of field, high quality lens for applications that typically require a greater working range. Semi-customization is possible when alternative optical specifications are required.

The new Hydra3D™ Time-of-Flight (ToF) CMOS image sensor, tailored for 3D detection and distance measurement. The sensor supports the latest industrial applications, including vision guided robotics, logistics and automated guided vehicles. Hydra3D’s high resolution and flexible configuration, combined with its on-chip HDR, make it ideal for outdoor applications such as surveillance, ITS, building construction and drones.

For media enquiries, please contact:
[email protected]

Notes to Editors:

About Teledyne

Teledyne’s Vision Solutions group form an unrivaled collective of imaging expertise across the spectrum.  Individually, each company offers best-in-class solutions. Together, they combine to leverage each other’s strengths and provide the widest imaging technology portfolio in the world. From aerospace through industrial inspection, scientific research, spectroscopy, radiography and radiotherapy, and advanced MEMS and semiconductor solutions, Teledyne offers worldwide customer support and the technical expertise to handle the toughest tasks.  Their vision solutions are built to deliver to their customers a unique and competitive advantage.

About the Vision Systems Design China Innovators Awards 2021
Vision Systems Design Innovators Award win a high admiration abroad for many years. Vision Systems Design China was brought the event to China in 2021, present the first VSDC Innovators Awards . It’s based on last year’s VSD Innovators Awards, combined with the development of machine vision of China. Machine vision enterprises and products of China or abroad be Invited to enter.  Each Vision Systems Design Innovators Awards Entry Should Address the Following:

1. The impact your product/system/technology has on designers, systems integrators, and/or end users. Areas to be addressed could include how it is original and innovative, how it fulfills a need in the market that hasn’t been addressed, increases productivity, leverages a novel technology, etc.
2. The unique features of this product/system/technology as it compares to existing solutions.
3. The product has a long life cycle and can be applied to the future technology development trend and market demand for a long time.

Munich, Germany – September 28, 2021 – Teledyne, a part of Teledyne Technologies  [NYSE: TDY], and a global leader in machine vision technology, will exhibit their newest technologies at Vision 2021 taking place October 5-7, 2021 in Stuttgart, Germany.

Teledyne will display the world’s most comprehensive, vertically integrated portfolio of industrial and scientific imaging technology including the latest from newly acquired Teledyne FLIR.

Visit the Teledyne booth and explore the unmatched capabilities and products from Teledyne’s DALSA, e2v, FLIR, and Lumenera business units. Your one source for unlimited vision will be on display at Stand 8 B10.

Teledyne will participate in the Industrial Vision Days with keynote and technology presentations taking place Wednesday, October 6, 2021:

• At 9:20 AM join Teledyne DALSA’s Matthias Sonder delivering his presentation entitled “Clarity at High Speed”
• At 4:20 PM be sure to attend Teledyne e2v’s Sergio Morillas speaking about “Highly reliable 3D imaging for challenging applications with Time-of-Flight”

New products introduced by Teledyne companies include:

• Linea HS 16K Multifield features charge-domain CMOS TDI sensor technology with 16k x (64+128+64) TDI arrays and a 5×5μm pixel size. It is the industry’s first TDI camera capable of capturing up to three images simultaneously in a single scan.
• Sapera™ Vision Software offers field-proven image acquisition, control, image processing and artificial intelligence functions to design, develop and deploy high-performance machine vision applications. In this new release, the AI tool Astrocyte^TM  allows learning at runtime for increased flexibility and performance on deployed systems.
• Topaz CMOS Sensors. New 2MP and 1.5MP CMOS sensors feature a low noise global shutter pixel.
• FLIR Lossless Compression: Break through GigE Bandwidth barriers with Teledyne FLIR’s new Lossless Compression feature which delivers up to 70% higher FPS with 100% data integrity.
• Preview a concept Teledyne FLIR camera providing both SWIR and visible light imaging in a single camera.
• Quartet Embedded Solution for Nvidia TX2 for easy integration of multiple cameras including AI capability.
• Achieve flawless 10GigE high speed performance with a new pre-integrated bundle of the Oryx camera with the Myricom NIC. Expected release date: Q4 2021.

 Click here to view our virtual booth with information on all demonstrations.

For media enquiries, please contact:

[email protected] | + 44 (0)1245 453607

About Teledyne

Teledyne’s Vision Solutions group form an unrivaled collective of imaging expertise across the spectrum. Individually, each company offers best-in-class solutions. Together, they combine to leverage each other’s strengths and provide the widest imaging technology portfolio in the world. From aerospace through industrial inspection, scientific research, spectroscopy, radiography and radiotherapy, and advanced MEMS and semiconductor solutions, Teledyne offers worldwide customer support and the technical expertise to handle the toughest tasks. Their vision solutions are built to deliver to their customers a unique and competitive advantage.

New Topaz sensors are ideal for mobile applications, offering an attractive price point with no-compromise performance.

Grenoble, FRANCE, September 14, 2021 – Teledyne e2v, a part of Teledyne Technologies [NYSE: TDY], has introduced its Topaz series of industrial CMOS sensors with new 2MP and 1.5MP resolution devices. These new 1920 x 1080 and 1920 x 800-pixel format sensors use state-of-the-art low noise, global-shutter pixel technology to offer powerful solutions and enable compact mobile designs for many applications.

Housed in a tiny 4.45 mm wide Chip Scale Package (CSP), the Topaz sensors have an optical array centre which precisely matches the mechanical centre of the package, allowing for a slim camera design. This makes them particularly suitable for miniature OEM barcode engine designs, mobile terminals and sleds, IoT, contactless authentication systems, wearable devices, drones and robotics. Their 1/3” optical format is made possible due to the small 2.5µm global shutter pixel that employs in-pixel CDS (correlated double sampling) and advanced dual light-guides to achieve good SNR at low-light, with low crosstalk for crisp images.

Gareth Powell, Marketing Manager for CMOS Sensors at Teledyne e2v said, “Modern logistics, retail, and manufacturing applications all require enhanced productivity and throughput, with longer working ranges. The new Topaz sensors were developed with this in mind, offering an excellent cost/performance ratio for high volume adoption. They also have a tiny footprint making them ideal to drive the world’s smallest barcode OEM engines and thinnest mobile platforms.”

Key Features

• Advanced 2.5µm x 2.5µm global shutter pixel
• Low readout noise of typically 3.3 electrons
• Excellent low light SNR performance with short exposure times
• Ultra-low dark signal for exceptionally good high temp performance
• Frame rate of >100 frames per second in 8 bit output mode
• 2 lane MIPI outputs (1.2Gpix/sec each) for seamless connection with CPU, ISP and other application processors
• Fast Wake Up mode – decode within 10 milliseconds after power up and other useful application features

Samples and evaluation kits are available now. Please contact us for more information.

Find out more about Topaz at VISION, 5-7 October 2021 in Stuttgart, Germany, Teledyne booth 8B10.

For media enquiries, please contact:

[email protected]

Notes to Editors:

Teledyne e2v’s innovations lead developments in healthcare, life sciences, space, transportation, defense and security and industrial markets. Teledyne e2v’s unique approach involves listening to the market and application challenges of customers and partnering with them to provide innovative standard, semi-custom or fully custom imaging solutions, bringing increased value to their systems.

For more information, visit imaging.teledyne-e2v.com

Grenoble, FRANCE, 29th June, 2021 — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and part of the Teledyne Imaging group, introduces Tetra, a low-cost, high-performance quad linear CMOS sensor family. The Tetra sensors are ideal for food sorting, recycling, logistics, pick-and-place, document scanning, and other machine vision applications that require cost-effective mono, color, and multispectral imaging.

Tetra sensors are available in a 2k resolution with a 14 μm x 14 μm pixel size, or 4k resolution with a 7 μm x 7 μm pixel size at a max line rate of 128kHz aggregate. The mono models can be configured to output one, two, or four rows and the color models provide RGB and mono outputs. Using wafer level coated dichroic filters, the sensor also provides spectrally independent RGB and NIR outputs for multispectral imaging.

Based on a synchronized shutter design, Tetra provide low read noise and high dynamic range with true correlated double sampling (CDS). Each channel has its own exposure control, resulting in easy-to-perform white balancing.

The ceramic LCC package also offers high performance and high reliability over a wide range of operating temperatures. The sensor data ports have high signal integrity and simple interfacing for quick system integration.

Florian Julien, Director of the Machine Vision Team at Teledyne e2v said, “The sorting industry has started to upgrade its traditional technology from color to multispectral imaging. With its unique RGB + NIR capability, Tetra has been designed as the next generation technology to enhance quality and safety in food sorting.”

Please visit the product page or contact us for more information.

Notes to Editors:

For media enquiries, please contact:
[email protected]

Teledyne e2v is part of the Teledyne Imaging Group. Their innovations lead developments in healthcare, life sciences, space, transportation, defense and security and industrial markets. Teledyne e2v’s unique approach involves listening to the market and application challenges of customers and partnering with them to provide innovative standard, semi-custom or fully custom imaging solutions, bringing increased value to their systems.
For more information, visit imaging.teledyne-e2v.com

Teledyne Imaging is a group of leading-edge companies aligned under the Teledyne umbrella. Teledyne Imaging forms an unrivalled collective of expertise across the spectrum with decades of experience. Individually, each company offers best-in-class solutions. Together, they combine and leverage each other’s strengths to provide the deepest, widest imaging and related technology portfolio in the world. From aerospace through industrial inspection, scientific research, spectroscopy, radiography and radiotherapy, geospatial surveying, and advanced MEMS and semiconductor solutions, Teledyne Imaging offers world-wide customer support and the technical expertise to handle the toughest tasks. Their tools, technologies, and vision solutions are built to deliver to their customers a unique and competitive advantage.