Newsroom

Teledyne e2v recognized by Vision Systems Design 2021 Innovators Awards Program in several categories

Grenoble, FRANCE/Seville, SPAIN, May 21, 2021 — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and part of the Teledyne Imaging group, has been recognized as being amongst the best in machine vision by the judges of the Vision Systems Design 2021 Innovators Awards program. Teledyne e2v won Silver Awards for its Flash CMOS sensor […]

Teledyne Imaging brings its advanced technologies to Vision China 2021

Live demos highlighting new AI and deep learning solutions at the booth Shanghai, China, March 4, 2021 — Teledyne Imaging will exhibit at the upcoming Vision China (Shanghai), in Hall W1, W1-1800, at the Shanghai New International Expo Centre from March 17-19. Visitors to the combined Teledyne Imaging booth can expect to see a broad […]

Teledyne e2v and Yumain announce collaboration to create AI-based imaging solutions for machine vision

Grenoble, FRANCE, March 2, 2021 —Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces a new technology and industrial collaboration with Yumain (Dijon, France), a leading AI vision solution provider serving a broad range of industrial applications. Together, the companies will develop cutting-edge bio-inspired vision solutions that can enable […]

Teledyne e2v’s new optical module ideal for scanning, embedded imaging and IoT applications

New 2MP Global Shutter MIPI module will enhance productivity and throughput Grenoble, FRANCE, September 8, 2020 — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces that it has expanded its product portfolio with a 2 Megapixel compact module featuring a pre-focused, industrial-grade scanning optic. This MIPI interfaced module […]

Teledyne e2v introduces its uniquely flexible high resolution ToF sensor for next generation 3D vision systems

New Hydra3D CMOS image sensor provides best-in-class 3D performance for robotics, logistics, automated guided vehicles and outdoor applications Grenoble, FRANCE, July 30, 2020 — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces Hydra3D™, its new Time-of-Flight (ToF) CMOS image sensor, tailored for 3D detection and distance measurement. The […]

Teledyne e2v honoured with Silver Vision Systems Design 2020 Innovators Award

Grenoble, FRANCE, June 16, 2020 — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announced today that its Emerald™ 67M CMOS image sensor was recognized among the best in the industry by the judges of the Vision Systems Design 2020 Innovators Awards program. The judging panel consisted of experts […]

Teledyne e2v expands its Emerald image sensor family with new compact global shutter 3.2MP sensor

Grenoble, FRANCE, April 28, 2020 — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces its new Emerald 3.2 Megapixel CMOS image sensor, specially designed to tackle the challenges of emerging applications such as security, drones and embedded vision, as well as traditional machine vision. With its 2.8 µm […]

Teledyne e2v expands its Emerald image sensor family with new 36 Mpixel high-speed chip

GRENOBLE, France, January 14th, 2020 — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces its new Emerald 36M, a 37.7 Megapixel image sensor specifically designed for demanding industrial and outdoor applications requiring both high resolution and high speed. Emerald 36M uniquely combines 6k square resolution and superior frame […]

Teledyne e2v introduces industry’s first 1.3MP Time-of-Flight sensor

New Bora 3D CMOS image sensor enables vision-guided robotics, logistics and surveillance GRENOBLE, France, 12 November 2019 — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces its new Bora™ Time-of-Flight CMOS image sensor, tailored for 3D detection and distance measurement to support the latest industrial applications, including vision […]

Teledyne e2v announces new CMOS Sensor Family,  targeted at 3D Laser Triangulation Applications

GRENOBLE, France, 3 September, 2019 — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces its Flash CMOS image sensor family, specifically tailored for 3D laser profiling/displacement applications and high speed, high resolution inspection. The new Flash sensors feature a 6µm CMOS global shutter pixel which effectively combines high […]