New 2MP Global Shutter MIPI module will enhance productivity and throughput Grenoble, FRANCE, September 8, 2020 — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces that it has expanded its product portfolio with a 2 Megapixel compact module featuring a pre-focused, industrial-grade scanning optic. This MIPI interfaced module […]

New Hydra3D CMOS image sensor provides best-in-class 3D performance for robotics, logistics, automated guided vehicles and outdoor applications Grenoble, FRANCE, July 30, 2020 — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces Hydra3D™, its new Time-of-Flight (ToF) CMOS image sensor, tailored for 3D detection and distance measurement. The […]

Grenoble, FRANCE, June 16, 2020 — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announced today that its Emerald™ 67M CMOS image sensor was recognized among the best in the industry by the judges of the Vision Systems Design 2020 Innovators Awards program. The judging panel consisted of experts […]

Grenoble, FRANCE, April 28, 2020 — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces its new Emerald 3.2 Megapixel CMOS image sensor, specially designed to tackle the challenges of emerging applications such as security, drones and embedded vision, as well as traditional machine vision. With its 2.8 µm […]

GRENOBLE, France, January 14th, 2020 — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces its new Emerald 36M, a 37.7 Megapixel image sensor specifically designed for demanding industrial and outdoor applications requiring both high resolution and high speed. Emerald 36M uniquely combines 6k square resolution and superior frame […]

New Bora 3D CMOS image sensor enables vision-guided robotics, logistics and surveillance GRENOBLE, France, 12 November 2019 — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces its new Bora™ Time-of-Flight CMOS image sensor, tailored for 3D detection and distance measurement to support the latest industrial applications, including vision […]

GRENOBLE, France, 3 September, 2019 — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces its Flash CMOS image sensor family, specifically tailored for 3D laser profiling/displacement applications and high speed, high resolution inspection. The new Flash sensors feature a 6µm CMOS global shutter pixel which effectively combines high […]

Teledyne e2v, and Teledyne DALSA, both Teledyne Technologies [NYE:TDY] companies, will exhibit their industrial vision solutions in booth 7938 at Automate 2019. Aligned within the Teledyne Imaging group of companies, the two will showcase a broad range of leading edge products targeted at logistics, robotics and packaging applications including the Snappy 2M bar code sensor, […]

Shanghai, China – Teledyne e2v and Teledyne DALSA, both Teledyne Technologies [NYSE: TDY] companies are pleased to announce their combined presence as Teledyne Imaging at Vision China Shanghai 2019. Located in in the Shanghai New International Expo Centre, the companies will display their most advanced vision solutions in Hall 5, booth H5-100, from March 20-22, 2019. Teledyne e2v will highlight […]

GRENOBLE, France, November 27, 2018 — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of vision solutions, announces the expansion of its Emerald family of CMOS image sensors with a new 5 Megapixel device. The EmeraldTM 5M is designed for machine vision, Automated Optical Inspection (AOI), and factory automation applications that require higher resolution […]