Industrial/Machine Vision
Industrial/Machine Vision
Our product brands are high performance benchmarks in industrial imaging around the world. Speed, resolution, and sensitivity are our hallmarks. From our most cost-conscious products to our fully bespoke solutions, we focus on our customers’ needs. Applications include:
Teledyne e2v is also able to offer full system solutions which encompass the surrounding electronic circuitry, providing customers with the highest levels of value-added solutions and flexibility.
We work closely with our customers to fully understand their particular machine vision application (and the challenges they are facing), to ensure we provide an imaging solution which brings them maximum value.
Our main capabilities include, fast sensors which increase the throughput of machines and high near-infrared sensitivity to overcome the limitations of standard silicon.
Emerald 2M | Emerald 3.2M & 5M |
Emerald 8.9M & 10M | Emerald 12M/16M |
Emerald 36M | Emerald 67M | Lince1M3 | Lince5M | Lince6M5 | Lince11M
The trend to replace laser readers with 2D ones, is well underway in all Automatic Data Collection market sub-segments (hand-held, mobile, fixed position and industrial auto identification).
To take full advantage of the technology transition, Teledyne e2v have designed the Snappy family of cost-effective, high quality CMOS imaging sensors with specific features dedicated to this application. These features allow the sensors to outperform the competition in speed (rapid time to read), precision (reduced illumination/when codes are damaged), power consumption, and other critical application parameters.
Read our article – Behind bars – a technological overview of the most pervasive of coding systems
Increasing automation and monitoring, the use of robotics, and other aspects of Industry 4.0 initiatives are further increasing demand for 3D imaging solutions which offer high levels of accuracy and distance measurement.
Teledyne e2v has developed the Bora and Hydra3D CMOS image sensors for Time of Flight (ToF) and the Flash CMOS sensor for laser triangulation 3D imaging. To meet the technical challenges of a customer’s particular market/application, we also offer a design service (at both sensor and system level) which includes evaluation kits, reference designs and simulation models to help support system development and shorten the time to market. We can also develop a derivative of an existing sensor, customization at system level or make a fully custom design.
Has 3D Finally Come of Age? Find out in our article.
