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Teledyne e2v introduces its uniquely flexible high resolution ToF sensor for next generation 3D vision systems

New Hydra3D CMOS image sensor provides best-in-class 3D performance for robotics, logistics, automated guided vehicles and outdoor applications Grenoble, FRANCE, July 30, 2020 — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces Hydra3D™, its new Time-of-Flight (ToF) CMOS image sensor, tailored for 3D detection and distance measurement. The […]

Teledyne e2v honoured with Silver Vision Systems Design 2020 Innovators Award

Grenoble, FRANCE, June 16, 2020 — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announced today that its Emerald™ 67M CMOS image sensor was recognized among the best in the industry by the judges of the Vision Systems Design 2020 Innovators Awards program. The judging panel consisted of experts […]

Night-sight: Competing technologies for the vision systems in autonomous vehicles

Infrared, lidar, and time-of-flight imaging offer hope in solving one of the industry’s toughest challenges By Ha Lan Do Thu, Marketing Manager for 3D imaging at Teledyne e2v It’s nighttime. You’re driving. A Chuck Berry song enters your mind: New Jersey Turnpike in the wee, wee hours / Rolling slowly because of drizzling showers. But, […]

Teledyne Imaging brings its newest solutions to AIA’s Vision Week

Teledyne Imaging, including Teledyne e2v, Teledyne DALSA, and Teledyne Lumenera, will showcase their newest technology at AIA’s virtual online vision week taking place May 18-22. Visitors to the virtual week-long event can expect to take in a wide range of innovative solutions from the industry’s leading machine vision supplier. Teledyne e2v’s Emerald 3.2M compact global […]

Teledyne e2v expands its Emerald image sensor family with new compact global shutter 3.2MP sensor

Grenoble, FRANCE, April 28, 2020 — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces its new Emerald 3.2 Megapixel CMOS image sensor, specially designed to tackle the challenges of emerging applications such as security, drones and embedded vision, as well as traditional machine vision. With its 2.8 µm […]

OPTRO 2020 Paper – Design-to-Technology for Night Vision

International Symposium on Optronics in Defence and Security (OPTRO), January 2020 Session: Sensors and Components N°53 Design-to-Technology for Night Vision Pierre Fereyre, Philippe Kuntz, Séverine André, José Ángel Segovia De La Torre & Rémi Barbier Introduction The market for night vision represents a wide panel of applications which purpose is to assist operators in visual […]

Teledyne e2v expands its Emerald image sensor family with new 36 Mpixel high-speed chip

GRENOBLE, France, January 14th, 2020 — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces its new Emerald 36M, a 37.7 Megapixel image sensor specifically designed for demanding industrial and outdoor applications requiring both high resolution and high speed. Emerald 36M uniquely combines 6k square resolution and superior frame […]

Teledyne e2v introduces industry’s first 1.3MP Time-of-Flight sensor

New Bora 3D CMOS image sensor enables vision-guided robotics, logistics and surveillance GRENOBLE, France, 12 November 2019 — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces its new Bora™ Time-of-Flight CMOS image sensor, tailored for 3D detection and distance measurement to support the latest industrial applications, including vision […]

Has 3D Finally Come of Age?

Has 3D Finally Come of Age?

26th September 2019

Has 3D finally come of age? By Ha Lan Do Thu, Marketing Manager and Pierre Fereyre, Sr. Principal Engineer Image Sensor Design If you looked only at the movie industry, you could be forgiven for thinking that 3D was a failure. Repeatedly, 3D has been promoted as the next big thing in movies, only for […]

Teledyne e2v announces new CMOS Sensor Family,  targeted at 3D Laser Triangulation Applications

GRENOBLE, France, 3 September, 2019 — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces its Flash CMOS image sensor family, specifically tailored for 3D laser profiling/displacement applications and high speed, high resolution inspection. The new Flash sensors feature a 6µm CMOS global shutter pixel which effectively combines high […]